| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Study of Electromigration-Induced Voids Formation in Solder Microbumps by Using 3D X-Ray Microscopy |
| Author(s) |
Shih-Chi Yang, Chih Chen |
| On-Site Speaker (Planned) |
Shih-Chi Yang |
| Abstract Scope |
Electromigration (EM) has been a pivotal reliability concern for the solder interconnects. To detect EM-induced voiding failures in the solder joints more effectively, non-destructive approaches were adopted as alternatives for the traditional cross-sectional methods. In this work, EM-induced voids in the 30-µm solder microbumps were characterized by 3D X-Ray microscopy which possess a high spatial resolution as low as 0.7 µm. The results of 3D X-Ray observation were found in great agreements with the cross-sectional views by backscattered electron (BSE) microscopy. Three levels of void failures (slight, medium, severe) were defined from 3D X-Ray images. To elucidate the variations in voiding levels, solder joints were subjected to various EM conditions. With equivalent resistance increments, voids were frequently observed (71%~75%) in the microbumps stressed at a high current density of 8*104 A/cm2. However, the percentage of microbumps with voids drops to 33% when the current density decreased to 1.6*10 A/cm2. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, Process Technology |