| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
A-19: Fatigue Life of Selective Laser Solder Joints of a MEMS Probe for Automotive Semiconductor Wafer Test |
| Author(s) |
Won Sik Hong, Myeongin Kim, Mi Song Kim |
| On-Site Speaker (Planned) |
Won Sik Hong |
| Abstract Scope |
Touch down tests of a MEMS probe for automotive semiconductor wafers was tested at 125℃ and over 100 M cycles. We selected mid- temperature solder alloys and optimized the temperature profile of the selective laser soldering process to ensure solder joint reliability. We finally compared the fatigue lifetime of Sn-3.0Ag-0.5Cu (SAC305) and Sn-0.7Cu MEMS probe solder joints. High cycle fatigue test condition was 15 gf load of under 50% yield strength, 3 Hz frequency and sine wave form. Sn-Cu solder joints performed better than SAC305. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, Process Technology |