| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Role of Grain Boundaries in Electromigration and Thermomigration Related Failure : A Phase Field Simulation Study |
| Author(s) |
Supriyo Chakraborty, Praveen Kumar, Abhik N Choudhury |
| On-Site Speaker (Planned) |
Supriyo Chakraborty |
| Abstract Scope |
Grain-boundary migration, void formation as well as associated
hillock
formation are important mechanisms which lead to the failure of
interconnects
in the microelectronic packages. An understanding of the underlying physics
of
each of the phenomena can allow better design of interconnects. We
formulate a
phase-field model for studying the phenomena of grain-boundary grooving
under
the combined
influence
of pure diffusion controlled transport, electric current and thermal
gradient.
We separately investigate the contributions of each of the stimuli towards
the
process of grain-boundary migration and hillock formation, by performing
phase
field simulations as well as comparing with analytical theories.
Additionally,
we qualitatively reproduce the phenomena observed in experiments on
polycrystalline metals, wherein electromigration and thermomigration may
act in
unison or against each other towards their contributions in grooving,
hillocking and void growth. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |