| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Enhancement of Strength and Aging Resistance in Sn-9Zn Alloys With Minor Bi Addition |
| Author(s) |
Yu-An Shen, Hao-Zhe Kao, Chih-Ming Liang |
| On-Site Speaker (Planned) |
Yu-An Shen |
| Abstract Scope |
Proper packaging is essential for advanced semiconductors, and employing lower melting lead-free solders benefits the environment. Eutectic Sn-Zn alloys have a lower melting point (199°C) than eutectic Sn-Ag and Sn-Ag-Cu alloys (approximately 217°C). However, due to the easy oxidation of Zn, eutectic Sn-Zn has not effectively reduced the soldering temperature. This study explored the influence of adding a small amount of Bi to lower the melting point of Sn-9Zn alloy and enhance its strength. The alloys were prepared using a casting process. Preliminary results indicated that Bi addition significantly lowered the melting point of eutectic Sn-Zn while enhancing its strength and elongation. Additionally, the Sn-Zn-Bi alloy demonstrated minimal changes in its mechanical properties after thermal aging, showcasing satisfactory aging resistance. Characterization techniques such as EPMA, XRD, and DSC were employed to analyze the materials. The study also included phase diagram calculations to correlate with the experimental results. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Mechanical Properties |