| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Characterization Techniques for Quantifying and Modeling Deformation
|
| Presentation Title |
Dislocation Pile-ups and Grain Boundary Interactions Studied Using In Situ Cross-Correlation EBSD in High Purity Nickel |
| Author(s) |
Yang Su, Thanh Phan, Liming Xiong, Josh Kacher |
| On-Site Speaker (Planned) |
Yang Su |
| Abstract Scope |
To study how grain boundary character affects grain boundary strength, high-resolution electron backscatter diffraction (HR-EBSD) analysis was conducted at ~50 grain boundaries in high purity nickel during in situ tensile deformation. Elastic strain gradients associated with the pileups were investigated, which were then used to calculate the stress buildup at the boundary. By comparing the stress along a slip band at different strain levels, it was found that the evolution of the stress tensor is related to the grain boundary character and the geometrical relationships of the slip bands across the boundary, with both stress increases and load drops after critical stress levels observed. Atomistic-to-microscale simulations were used to investigate the details of the interactions. This evolution in local stress as a function of applied strain will be discussed in terms of grain boundary and geometrical metrics, including m’, residual Burgers vector, strain energy density, and grain boundary coherency. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Mechanical Properties, Modeling and Simulation |