| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Investigation of Electroless Ag-Passivated Cu-to-Cu Direct Bonding and Micro Cu Pillar Bonding
|
| Author(s) |
Ming-Hsuan Hsieh, Yung-Sheng Lin, Yun-Ching Hung, Chun-Wei Chiang, C. Robert Kao |
| On-Site Speaker (Planned) |
Ming-Hsuan Hsieh |
| Abstract Scope |
Cu-to-Cu direct bonding has been recognized as the primary method for creating high-density interconnects. However, it traditionally requires high temperature, high pressure, high vacuum condition and an extremely flat surface. Consequently, in this research, electroless sliver is plated onto the copper substrate as passivation layer to enable low-temperature and low-pressure bonding. Additionally, we apply this sliver passivation layer to micro Cu pillars bonding and investigate its applicability in high-density and high-performance applications. This study includes thermal compressive bonding experiments conducted under different temperatures and pressures, with the bonding quality and mechanisms assessed through top-view and cross-sectional image analysis. The result provides valuable insights into optimizing the bonding techniques, contributing to the future development of semiconductor interconnect technologies. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Joining, Process Technology |