| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
2021 Technical Division Student Poster Contest
|
| Presentation Title |
Solidification and Defects Structure Evolution in Metal Additive Manufacturing via Molecular Dynamics Simulations |
| Author(s) |
Gurmeet Singh, Veera Sundararaghavan |
| On-Site Speaker (Planned) |
Gurmeet Singh |
| Abstract Scope |
Additive manufacturing is now being routinely used in industry to build metal parts due to the flexibility it allows in part design. In this work, we look at additive manufacturing of a single crystal using molecular dynamics simulation where a melt pool is incrementally added to a periodic structure to build a column from the bottom up. Embedded atom model potential is utilized in the atomic simulations and the evolution of different types of structures and defects in a layer-by-layer manner during the deposition of material is studied. Preliminary studies show that the percentage of defect-free content for additively manufactured copper converges when a sufficient number of layers is reached. Slower cooling rates improve the FCC content for all the layers; however, the benefits of slow cooling reduce beyond a point. The influence of substrate temperature and nano-inclusions are also investigated for defect evolution in the additive column. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Additive Manufacturing, Modeling and Simulation, Solidification |