| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Interconnect-Based Sensor Array for Characterizing Thermal Management of IC Chips |
| Author(s) |
Graham Werner, Oliver Trzcinski, Weili Cui, Ping-Chuan Wang |
| On-Site Speaker (Planned) |
Graham Werner |
| Abstract Scope |
The advancement of integrated circuit technologies necessitates ever-increasing power densities which creates the potential for excess heating, affecting reliability and performance. To address this, improvements in thermal management solutions are essential. A recent research project initiated at SUNY New Paltz focuses on designing novel cold plate structures to efficiently remove hotspots. A critical component of this test system is an interconnect-based temperature sensor array designed to measure a chip’s temperature distribution. Leveraging the temperature-dependent resistivity of typical interconnect materials, the sensor integrates with the cold plate test system to measure the formation and mitigation of hotspots. This presentation will detail the rationale for selecting and optimizing the metallization structures for temperature sensing, and the considerations for its performance and reliability. Further developments in automated data acquisition and the implications of its spatial and temporal resolution limits will be addressed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Thin Films and Interfaces, |