| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
2024 Technical Division Student Poster Contest
|
| Presentation Title |
SPG-39: Impact on Microstructure and Densification of High and Low Heating Rates Sintering for Copper Modern Advanced Manufacturing |
| Author(s) |
Santiago Vargas, Camilo Bedoya Lopez, Nived Sanjay, Gil Rubia, Carlos E. Castano |
| On-Site Speaker (Planned) |
Camilo Bedoya Lopez |
| Abstract Scope |
Sintering of copper alloys has been extensively used in the advanced manufacturing of semiconductor devices, heat sinks, welding electrodes, and switch gears. This work studies the sintering and densification of parts by conventional (<5°C/min) and high heating rate (>60°C/min) processes. Two kinds of spherical powders were employed: A narrow size of ~10 µm and a polydisperse size distribution between 37 µm and 88 µm. The sintering mechanism and activation energies were analyzed by measuring the necking evolution and grain sizes on the surface and cross-sectioned specimens. Grain surface evaporation occurred predominantly for small particle sizes, while grain boundary volume diffusion dominated the transport mechanism for the polydisperse size material. Similarly, the high heat flux gradients in modern advanced manufacturing promoted grain growth evolution and other microstructure and property anisotropies. Finally, allometric functions were fitted to predict the densification of the specimen depending on the particle size and sintering conditions. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Copper / Nickel / Cobalt, Powder Materials, Process Technology |