| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Transformations and Microstructural Evolution
|
| Presentation Title |
Controlling Microstructure of Nanotwinned Cu by Tuning the Electroplating Temperatures and Chemical Additives |
| Author(s) |
Kuan-Ju Chen |
| On-Site Speaker (Planned) |
Kuan-Ju Chen |
| Abstract Scope |
We fabricate different microstructures of nt-Cu films by changing chemical additives and electroplating parameters. By tailoring the chemical additives and electroplating temperatures, we are able to electroplate Cu films with different grain sizes and twin densities. It seems like some impurities would significantly influence the growth of twins and the nucleation conditions, resulting in the different grain sizes. Also, we conduct the thermal stability experiments of the nt-Cu with different microstructures. Interestingly, the nt-Cu films with a smaller grain size exhibited a higher thermal stability which contradicts the classical theory. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |