About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Aluminum Alloys: Development and Manufacturing
|
Presentation Title |
Enhancing Thermal Stability of Al-Mg-Si-Cu Alloys through Ag and Sc Additions |
Author(s) |
Hyeon-Woo Son, Jae-Seok Lee, Kwangjun Euh |
On-Site Speaker (Planned) |
Kwangjun Euh |
Abstract Scope |
The combined addition of Ag and Sc in an Al-Mg-Si-Cu alloy, along with increased Cu content, significantly enhances thermal stability by preventing over-aged precipitate growth. Ag addition delays hardness degradation during over-aging, while Sc reduces precipitation kinetics in both early and over-aging stages, creating a synergistic effect that improves thermal stability. Ag enhances stability through disordering and solute segregation, while Sc, though present in low amounts, disrupts Cu diffusion by forming Sc-Cu pairs. This interaction not only enhances thermal stability but also delays age-hardening kinetics by disturbing the formation of Cu-containing precipitates. Additionally, Ag and Sc accelerate the formation of Mg-rich clusters during early-stage aging, which act as precursors to Cu-containing precipitates, further contributing to the alloy's enhanced thermal stability. |
Proceedings Inclusion? |
Planned: Light Metals |
Keywords |
Aluminum, Characterization, Other |