| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Modification of Traditional Pb-free Solders with Bi, Sb and In for Improved Reliability |
| Author(s) |
Sergey A. Belyakov, Tetsuro Nishimura, Keith Sweatman, Jingwei Xian, Christopher Gourlay |
| On-Site Speaker (Planned) |
Sergey A. Belyakov |
| Abstract Scope |
There has been a significant industrial and scientific interest in the development of next-generation Pb-free solders with improved thermal cycling properties and ability to provide adequate performance in increasingly aggressive environments. Traditional Sn-Ag-Cu and Sn-Cu-Ni-based solders are modified with various major alloying additions such as Bi, Sb, In etc. to improve their mechanical response in emerging applications. In this study we explore the role of Bi, Sb, In or their combined additions on microstructure formation and mechanical properties of Sn-Cu-Ni/Cu and Sn-Ag-Cu/Cu solders joints. The focus is on (i) new phases caused by the additions of Bi, Sb, In to the base solders and the overall microstructures, (ii) mechanical response of obtained microstructures during shear impact and fatigue tests at a range of temperatures. Finally, the influence of the additions on solder joint failure mechanisms will be addressed. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |