| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior Related to Interface Physics IV
|
| Presentation Title |
Thermo-Mechanical Molding of High-Entropy Alloy Nanowires via Interface Diffusion |
| Author(s) |
Ethen T. Lund, Joana De La Torre, Arindam Raj, Yi-Xiang Yang, Michael Aderibigbe, Sungwoo Sohn, Jan Schroers |
| On-Site Speaker (Planned) |
Ethen T. Lund |
| Abstract Scope |
Nanowires are fabricated from a feedstock alloy of equiatomic CrMnFeCoNi via growth into the nanocavities of an alumina mold. The mechanism of growth is shown to proceed via both dislocation slip and interface diffusion at different temperatures, while bulk diffusion is considered but not observed. The effects of temperature, pressure, and alumina dimensions on nanowire composition, length, and structure are investigated, giving insight into interdiffusion among the alloy elements. Further, interfaces between feedstock alloy, alumina mold, and nanowires are observed and considered. These results will enable the fabrication of high aspect ratio nanowires of high-entropy alloy systems and help to better understand their fast and sluggish diffusion processes. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
High-Entropy Alloys, Thin Films and Interfaces, |