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Meeting TMS Specialty Congress 2025
Symposium 8th World Congress on Integrated Computational Materials Engineering (ICME 2025)
Presentation Title Enhanced Thermal Conductivity for Modified hBN and Epoxy Composite Using Electric Field
Author(s) Sidra Ajmal, Abul Fazal Arif
On-Site Speaker (Planned) Sidra Ajmal
Abstract Scope Hexagonal boron nitride (hBN) exhibits exceptional thermal and dielectric characteristics making it a suitable filler for enhancing thermal conductivity in high-temperature polymer matrix. In this study, hBN/epoxy composites were synthesised and their thermal conductivity was thoroughly examined. Furthermore, hBN particles were functionalized using plasma modification to improve the compatibility with the epoxy matrix. The composite fabrication involved compression molding, followed by drying in a vacuum oven at 70°C for 6 hours. An electric field was applied during the process to achieve directional alignment of the hBN particles, further enhancing thermal conductivity. The present work employs a representative volume element (RVE) approach and periodic boundary conditions (PBC) to accurately predict thermal conductivity (K), elastic modulus (E) and coefficient of thermal expansion (α) using 3D finite element (FE) simulations. The resulting composites exhibited significantly improved thermal properties, making them promising candidates for efficient heat dissipation in high-performance electronic devices.
Proceedings Inclusion? Undecided

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