| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
Electromigration Effect Upon Single-phase and Two-phase Ag-Cu Alloy: an In-situ Study |
| Author(s) |
Yu-Chen Liu, Yung-si Yu, Shih-kang Lin, Shang-Jui Chiu |
| On-Site Speaker (Planned) |
Yu-Chen Liu |
| Abstract Scope |
Electromigration (EM) is one of the major failure modes of electronic interconnections. Ag, Cu, and their alloys are most commonly used materials for electronic interconnection. However, the EM effect upon Ag-Cu alloys are not systematically studied. Herein, the Ag-xCu alloys (x = 2.26 and 27.98 at.%) with single and two fcc phases, respectively, were subjected with current stressing for in situ characterizations using scanning electron microscopy and synchrotron radiation-based X-ray diffractometry. The peculiar phenomena and microstructures in the single-phase and two-phase Ag-Cu alloy strips under current stressing, e.g., (1) anomalous grain growth, (2) the formation of submicron cord-like grain with an aspect ratio over 1000, and (3) the formation of asymmetric hillock/voids clusters, are revealed and elaborated based on in situ characterizations. The conclusion can be drawn that the single-phase alloy would have better EM-resistance than multi-phase alloy strips unless the electron flow-induced strains are similar among the phases. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |