| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Void Reduction in Indium TIM in BGA and Large Size Packaging |
| Author(s) |
Mina Yaghmazadeh, Youngjin Kim |
| On-Site Speaker (Planned) |
Mina Yaghmazadeh |
| Abstract Scope |
Ongoing advancement in electronic packaging demands high-power density chips. Thermal management of these devices is challenging. Indium has been successfully used as TIM1 in thermal management system for LGA and PGA packaging for two decades. Attempts to adopt indium as TIM1 in BGA packaging has been challenging. During multiple reflow process steps, required for BGA packaging, excessive voids form at the interface of die/indium TIM/lid. Voids diminish thermal properties of the TIM, making conventional indium an ineffective choice in thermal management of these devices. In this research, a new generation of indium TIM is examined. This class of indium TIM does not require chemical flux/ reduction atmosphere to assist wetting/bonding indium to the substrates during indium attachment process. Results shown significant improvement in void reduction using this class of Indium TIM. A method to assist restricting indium TIM on the die prior to lid attachment process is also introduced. |
| Proceedings Inclusion? |
Planned: |