| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Enhancing Low-Temperature Solder Reliability With
Hybrid SAC/SnBi Systems
|
| Author(s) |
Po-Kai Chang, Shang-Yang Chen, Kelvin Li, Chang-Meng Wang, Albert T. Wu |
| On-Site Speaker (Planned) |
Po-Kai Chang |
| Abstract Scope |
One approach to lowering the thermal budget for device fabrication is the use of low-temperature solder (LTS) in electronic devices, which can lead to significant energy savings. However, solder alloys within the Sn-Bi system face reliability issues at operating temperatures due to the coarsening of the Bi-rich phase, which segregates at the interface between the under-bump metallization (UBM) and the solder balls. Recent research suggests that incorporating a hybrid joint system containing both Sn3Ag0.5Cu (SAC) and LTS can improve reliability. This study investigates the heterogeneous interfacial reactions in various SAC and Sn-Bi hybrid systems through microstructural observations and elemental analyses. Reliability tests, including shear strength tests of electronic components and electromigration tests on a daisy chain test vehicle, were conducted. The results detailing performance on reliability and microstructural changes are presented in this work. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |