About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection Materials II
|
Presentation Title |
Designing Mechanically Resilient Thermal Interface Materials |
Author(s) |
Geeta Pokhrel, Chelsea Davis, John Howarter |
On-Site Speaker (Planned) |
Geeta Pokhrel |
Abstract Scope |
Thermal Interface Materials (TIMs) play a critical role in electronics by enhancing heat dissipation between heat source and sink. TIMs endure harsh conditions of temperature cycling, mechanical stress, humidity, vibration, and shock, which can compromise thermal conduction efficiency and lead to failure. While thermal properties are extensively studied, mechanical properties crucial for electronic reliability are often overlooked in literature. This study focuses on fabricating Type II TIMs—elastomeric/thermal pads—using polymer blend nanocomposites. Functionalized 2D boron nitride (BN) nanosheets are incorporated to enhance thermal conductivity. The TIMs, based on polystyrene (PS) and polyisoprene (PI) with a pseudo-bicontinuous morphology, mostly show recoverable performance on returning from various mechanical strains. TIMs fabricated range from nano to micron scale thickness and are characterized for morphological, mechanical, and thermal properties. The insights gained from this study aim to scale up the processing to industrial scale and optimize thermal and mechanical performance for electronics packaging. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Characterization, Composites |