| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications XI
|
| Presentation Title |
Effect of Interfacial Stability of Bi2Te3 Thin Film Modules on Thermoelectric Property |
| Author(s) |
Kai-Wen Cheng, Albert T. Wu |
| On-Site Speaker (Planned) |
Kai-Wen Cheng |
| Abstract Scope |
With decreasing in the dimension of thermoelectric modules, the interfacial stability between thermoelectric materials and metal electrode becomes crucial. Serious interfacial reaction at the interface affects the thermoelectric properties and the reliability. In this study, Bi2Te3 thermoelectric thin films with highly preferred orientation were fabricated by co-sputtering deposition method and annealing process. Cu was selected as the electrode due to its high electrical conductivity. The effect of Cu diffusion from the electrode into Bi2Te3 thin films was investigated through long-term heat treatment. The thermoelectric power shows a significant degradation when Cu atoms diffuse into Bi2Te3 thin films and react with Te to form CuTe compounds. Furthermore, contact resistivity at the interface between Cu electrode and Bi2Te3 thin films substantially increases with aging time. The results suggest that the reliability of the thin film thermoelectric module deteriorates after long-term heat treatment. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Electronic Materials, Copper / Nickel / Cobalt |