| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Solid State Diffusion Bonding of Metals and Alloys
|
| Presentation Title |
Microstructural Characterizations and Mechanical Properties of Diffusion Bonded Stainless Steel 316H and Inconel 800H |
| Author(s) |
Mohamed S. Elbakhshwan, Ian Jentz, Collin Magnin, Andrew Brittan, Mark Anderson, Todd Allen |
| On-Site Speaker (Planned) |
Mohamed S. Elbakhshwan |
| Abstract Scope |
Advancements in manufacturing processes have resulted in significant improvements in heat exchanger technology. Compact heat exchangers (CHXs) are developed for efficient transferring of heat with low space and weight requirements, high thermal effectiveness, low-pressure drop, and moderate to high design pressure capability. Solid state diffusion bonding is an essential process used in the manufacture of CHXs in many industries. In this study we will discuss the microstructural characterizations and mechanical properties of diffusion bonded joints of high temperature alloys: Stainless Steel 316H and Inconel 800H. Post-bonding characterizations revealed several microstructural changes in the alloys such as grain diffusion across the bonding line, grain growth in regions attached to the bonding line, and diffusion of the interdiffusion layers. These changes force the bonded region to have different microstructure and mechanical response compared to the parent alloy. Therefore, correlations between the microstructure and alloy strength and creep resistance will be discussed. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |