| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
The Effect of Temperature on the Microstructure, Lattice, Mechanical and Electrical Properties of Sn-Bi Alloys |
| Author(s) |
Xin Fu Tan, Stuart D McDonald, Keith Sweatman, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Xin Fu Tan |
| Abstract Scope |
Sn-Bi low temperature solders have attracted interest because of their low liquidus temperature, low costs and non-toxicity. While the solubility of Sn in Bi is relatively low, the solubility of Bi in Sn can range from approximately 3 w% at room temperature to 21 wt% at the eutectic temperature at 139°C. This results in the dissolution and precipitation of Bi into and out of Sn as the temperature varies, causing significant changes to the microstructure, lattice, and mechanical and electrical properties of the Sn-Bi solders. This talk discusses the temperature-dependent microstructure, crystal structure, and mechanical and electrical property changes of Sn-Bi solder alloys, characterised by various temperature controlled in-situ testing methods. These methods include scanning electron microscopy (SEM), synchrotron powder X-ray diffraction (PXRD), tensile testing and four-point electrical resistance measurements. The work highlights the non-linear changes in lattice parameters, mechanical properties and electrical resistivity with respect to temperature. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Mechanical Properties, |