| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Blind Hole Filling With Nano-Twinned Copper in Bulid Up Pcbs |
| Author(s) |
Jui-Sheng Chang |
| On-Site Speaker (Planned) |
Jui-Sheng Chang |
| Abstract Scope |
With the development of miniaturization and multi-functionality in electronic products, the concept of three-dimensional stacking circuits has been widely applied in High-Density Interconnection (HDI) technology for Printed Circuit Boards (PCBs). During the manufacturing of HDI-PCBs, blind vias filled with electroplated copper are commonly used to form vertical connections between different layers of conductor circuits.
The microstructure of electroplated copper layer often determines the reliability of vias. Therefore, introducing nano-twin copper, which exhibits better thermal stability and mechanical properties compared to polycrystalline mirostructure, enhances the performance and reliability of microelectronic packaging. The conductive substrate at the bottom of the hole is used as a plating seed layer, and then the micro-vias is filled with a plating solution with special additives. This can achieve superfilling of the nano-twin copper in the micro-vias.
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| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Electronic Materials, Mechanical Properties |