| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Electromigration Failure Mechanisms and Microstructural Changes of Silver Sintered Joints Under Different Bonding Thickness |
| Author(s) |
Yun-Chan Kim, Dong-Yurl Yu, Shin-Il Kim, Min-Ji Yu, Dongjin Byun, Junghwan Bang |
| On-Site Speaker (Planned) |
Yun-Chan Kim |
| Abstract Scope |
As the demand for miniaturization in next-generation electronic packaging continues to increase, the current density at the joint is also increasing. While numerous studies have examined the electromigration (EM) characteristics of solder joints, research on the EM characteristics of Ag sintering joints has not been extensively covered. In this study, we investigated the EM characteristics and microstructural changes of Ag sintering joints at 150°C under different bonding thickness. Utilizing Ag sintering bonding technology, which can replace solder due to its excellent electrical and thermal conductivity, we bonded dummy chips to bare Cu substrates. Delamination was observed between the Cu substrate and the Ag sintering joint owing to EM, and the extent of delamination increased with longer time. Additionally, differences in microstructural changes due to EM were noted between the cathode and anode. This study discussed the electromigration properties of Ag sintered joint according to bonding thickness. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Other, Other |