| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Progress towards Understanding the Synthesis and Behavior of Metals Far from Equilibrium: A SMD Symposium Honoring Enrique Lavernia on the Occasion of His 60th Birthday
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| Presentation Title |
Effects of Processing and Grain size on Very High Strain Rate Deformation of Cu |
| Author(s) |
Kyung-Tae Park, Keunho Lee, Seok Bong Kim, LeeJu Park, Seong Lee |
| On-Site Speaker (Planned) |
Kyung-Tae Park |
| Abstract Scope |
Deformation behavior and microstructural evolution of Cu during very high strain rates over ~10<sup>5 </sup>/s were examined in a wide grain size range of ultrafine (UFG), fine (FG), and coarse (CG) grains. UFG Cu was processed by equal channel angular pressing (ECAP) and FG Cu was processed by low temperature annealing after ECAP. Dynamic tensile extrusion (DTE) tests were carried out for very high strain rate deformation. In the DTE test, a spherical sample is launched from a gas gun with the speed of ~500 m/s to the conical DTE die so that the estimated strain rate reaches over ~10<sup>5 </sup>/s. The DTE fragments were softly recovered, and the microstructure was examined. The deformation characteristics were simulated based on hydrodynamics and compared with experimental. The resultant very high strain rate deformation behavior of Cu will be discussed mainly focusing on the effects of the processing condition and the grain size. |
| Proceedings Inclusion? |
Undecided |