| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Impact of Microstructure on the Joule Heat Behaviors of Solder Interconnects |
| Author(s) |
Choong-un Kim, Chuanhao Nie, Dharani Sholapur, Tae-Kye Lee, Gnyaneshwar Ramakrishna |
| On-Site Speaker (Planned) |
Choong-un Kim |
| Abstract Scope |
This paper reports findings suggesting that the Joule Heat (JH) properties of solder joint are not as simple as conventionally thought as they are found to be sensitively affected by the microstructure of solder joint. The existing theories on JH and resulting temperature increase in packaging assembly are simple to understand. However, limited structural redundancy combined with microstructural complexity of solder joints in highly integrated and miniaturized assembly makes such theories inadequate for correctly describing global/local temperature by JH. Motivated by the need for the improved understanding, we have studied JH behaviors of solder joint in detail firstly by developing a method of tracking kinetics of temperature rise and secondly by correlating the rate and degree of temperature rise to the microstructure of solder joints assembled in various form factors with varying alloy compositions. This paper presents the highlights of our study along with discussion on the probable mechanisms. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Phase Transformations |