| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
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| Presentation Title |
Liquid-Solid Interfacial Reactions Between Lead-Free Solders and Cu-6.01wt.% Sn-0.12wt.%P Alloy (C5191) |
| Author(s) |
MAVINDRA RAMADHANI, Hsiang Yu Chiu, Yee wen Yen |
| On-Site Speaker (Planned) |
MAVINDRA RAMADHANI |
| Abstract Scope |
The Cu-6.01Sn-0.1P (in wt.%) alloy (C5191) has high mechanical strength, stress-good corrosion and heat resistance. It is suitable to replace the Cu tone the lead frame in the electronic packaging industry. The liquid/solid interfacial reactions between C5191 substrate and three lead-free solders (LFSs)-Sn, Sn-3.0wt.%Ag-0.5wt.%Cu (SAC), and Sn-0.7wt.%Cu (SC) at 240, 255, and 270°C for 0.5-10 h were investigated in this study. The scalloped Cu6Sn5 and layered Cu3Sn phases were formed at the LFS/C5191 interfaces in all couples. After 10-h reaction, the scalloped Cu6Sn5 phase gradually became the layered Cu6Sn5 phase in the Sn/C5191 couple. The total thickness of IMCs was increased with the increase in the reaction times and temperatures. Meanwhile, the linear relationship between the thickness of the IMCs and the square root of reaction time was found in all LFS/C51915 couples. This result revealed that the IMC growth mechanism in all couples was diffusion controlled. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, Electronic Materials, Other |