| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
The Kinetic Analysis and Inhibition Efficiency of the Anti-immersion Agent for the Ag Replacement Reaction. |
| Author(s) |
Chieh Pu Tsai |
| On-Site Speaker (Planned) |
Chieh Pu Tsai |
| Abstract Scope |
Silver(Ag) plated copper (Cu) is used as the lead frame in the wire bonding package because Ag has excellent reflection and thermal conductivity. Thus, an Ag-plated Cu lead frame is commonly applied in the LED industry. Additionally, electroplating Ag on the ENEPIG substrate can improve the adhesion between wires and substrate, enhancing the IC package's reliability. However, the replacement reaction occurs spontaneously after the Cu substrate immerses into the Ag plating bath, which induces poor adhesion for the Ag layer due to the void formation in the Ag/Cu interface. Therefore, it is an effective way to inhibit the replacement reaction that the Cu substrate pre-dips into the anti-immersion agent before electroplating Ag. In this study, we proposed an anti-immersion agent and analyzed the adsorption behavior on the Cu substrate using the three-electrode system and finally observed the effect of concentration and temperature of the anti-immersion agent on the replacement reaction. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Surface Modification and Coatings, Other |