| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Thermal Strain Measurement of Solder Joint in Electronic Packages |
| Author(s) |
Minjeong Sohn, Minhyuck Lee, Dongyurl Yu, Byeong-Kwon Ju, Tae-Ik Lee |
| On-Site Speaker (Planned) |
Minjeong Sohn |
| Abstract Scope |
In analyzing mechanical reliability of electronic pacakages, it is important to evaluate microscopic deformation of the interconnection region. During manufacturing process and operation period, thermally induced deformation plays critical role in fatigue failure of the package assemblies. Therefore, accurately evaluating thermal strain of solder joint is essential to deal with the thermal reliability issues. In this study, the scanning electron microscopy (SEM) images from the reference and deformed subset were examined by digital image correlation (DIC) method for obtaining strain measurement. Micro-scale particles were uniformly patterned on the surface of the solder joint using spray-coating method. After patterning process, the sample surface exhibited high contrast speckle patterns on the solder balls. For reliability test, the solder joint sample was exposed to drastic thermal fatigue environment between high and low temperature. A strain map of mises strain was obtained and partially concentrated strain on corners of the solder joint was identified. |
| Proceedings Inclusion? |
Planned: |