| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Advanced Thermal Management in Electronics: Micro-Nano Copper Forest Wicks for Thin Vapor Chambers |
| Author(s) |
Meng-Wen Wang, Chien-Neng Liao |
| On-Site Speaker (Planned) |
Meng-Wen Wang |
| Abstract Scope |
As portable electronic products continue to evolve towards greater compactness and high performance, the management of heat dissipation in confined spaces has become a significant challenge. Thin vapor chambers (TVCs) represent a promising thermal solution due to their exceptional heat spreading capability. The capillary wick facilitates the conveyance of condensed liquid back to the evaporation zone and thereby completing the fluid circulation cycle. In this study, micro-nano copper forest wicks were fabricated by electrodeposition, and a bonding process was developed to prepare the TVC devices. The objective of this study is to examine the influence of wick structure height on the thermal resistance of the TVC. The key findings include the effectiveness of micro-nanostructure enhanced wick and diffusion bonding techniques on welding the TVCs, as well as the benefits of using copper alloys over pure copper for improved mechanical strength, which elevates the efficiency of TVCs in electronic packaging applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Thin Films and Interfaces, Mechanical Properties |