| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Aluminum Alloys: Development and Manufacturing
|
| Presentation Title |
Effect of Tungsten Content on the Thermal Conductivity and Thermal Expansion of Aluminum-Graphite Composites |
| Author(s) |
Hyun-Kuk Park, Min-Hyeok Yang, Yu-Gyun Park, Hyoung-Seok Moon |
| On-Site Speaker (Planned) |
Hyun-Kuk Park |
| Abstract Scope |
Controlling thermal flow is crucial for high-performance semiconductors. Copper (Cu) and aluminum (Al) are commonly used as heat sinks, but their high thermal expansion coefficients can be problematic. To address this, Al with graphite (Gr) and tungsten (W) were mixed to reduce the thermal expansion coefficient and enhance thermal properties. Al-50 vol.% Gr-0.2, 0.5, and 0.8 wt.% W powders were sintered at 550°C, 60 MPa for 2 min. The relative density exceeded 98% with increased W content, as W promoted densification pores were formed between each interface due to the wettability of the Al, and Gr. This is due to the content of Gr, which maintains a stable state at high temperatures, affecting the relative density. Moreover, the results of thermal conductivity and thermal expansion as a function of the W contents, the most important indicators of this study, demonstrated the importance of porosity and the orientation of graphite. |
| Proceedings Inclusion? |
Planned: Light Metals |
| Keywords |
Aluminum, Process Technology, Composites |