| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Interfacial Reactions Between the Molten Sn Solder and Cu-2.3Fe wt.% (C194) Substrate |
| Author(s) |
Jing-ting Chou, Andromeda Dwi Laksono, Jun Wen, You-yan Li, Yee-wen Yen |
| On-Site Speaker (Planned) |
Jing-ting Chou |
| Abstract Scope |
This study investigated the interfacial reactions between molten Sn and Cu-2.3 wt. % Fe alloy (C194) using the liquid/solid reaction couple technique. The Sn/C194 couples were reacted at 240, 255, and 270°C for 0.5-4 h. The (Cu, Fe)6Sn5 phase appeared in the Sn/C194 reaction couple. The (Cu, Fe)3Sn phase appeared by increasing the reaction times and temperatures. The spalling distance of the intermetallic compounds (IMCs) in the Sn/C194 couples also increased with the reaction times and temperatures. This was caused by the addition of the Fe in the C194 substrate that offered the heterogeneous nucleation site, which caused the spread of the (Cu, Fe)6Sn5 phases in the form of an island-like shape. Overall, in the Sn/C194 couples, the IMC growth mechanism was diffusion controlled for 0.5-1.5 h and reaction controlled for 2-8 h. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Other |