| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior Related to Interface Physics IV
|
| Presentation Title |
On the impact of individual grain boundaries in Cu on electrical conductivity and strength |
| Author(s) |
Gerhard Dehm |
| On-Site Speaker (Planned) |
Gerhard Dehm |
| Abstract Scope |
Grain boundaries strongly influence physical and mechanical properties of material. However, the impact of an individual grain boundary is less well known, but important for miniaturized material applications, where very few grain boundaries are present. We studied over the last years experimentally by four point probe measurements inside the scanning electron microscope if different types of grain boundaries in Cu scatter electrons in a different manner and if so what is the main reason. Similarly, grain boundary – dislocation interactions govern the strength of polycrystalline materials. But what is the impact of a single grain boundary? And will this again depend on grain boundary character? Will strain rate and chemical composition also matter? Micro-pillar compression is used to study the impact of individual grain boundaries on slip transmission and the underlying mechanisms. Interestingly, the behavior of different grain boundaries is vastly different. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Thin Films and Interfaces, |