| About this Abstract |
| Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
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| Symposium
|
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Presentation Title |
Hybrid Electromagnetics: Printed RF Sensitive Structures, Circuits, and Sensors Integrated with Non-traditional Electromagnetic Substrates |
| Author(s) |
Lucas Unger, Christopher Molinari, Basil Vanderbie, Samuel Fedorka, Gary Walsh, Corey Shemelya |
| On-Site Speaker (Planned) |
Christopher Molinari |
| Abstract Scope |
Nonprinted, nontraditional substrates have seen increasing use in printed RF electronics applications. However, these substrates present significant design challenges to overcome, such as coarse surfaces, flexibility, and multilayer designs. For example, the performance of RF structures printed upon textiles or multilayer laminates are limited by uneven ink deposition, “bleeding” effects, poor ink adhesion, and poor component adhesion. This work demonstrates solutions to many of these problems including methods for blind, multilayer fabrication, extrudable RF encapsulants, printable surface wetting materials, and reliable adhesion and alignment devices for RF ICs. As a case study, we demonstrate an encapsulated RF sensing circuit printed directly atop a polyethylene fiber laminate using direct-write printing methods, alongside a multi-layer frequency selective surface embedded within an RF radome laminate. Our work can offer innovative ideas for how additively manufactured RF circuits and ICs can be integrated “on-demand” to meet new and novel goals. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |