| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Potential for Improving Sn-Cu Alloys as High-temperature Solders by the Suppression of Cu3Sn Phase |
| Author(s) |
Syeda Mehreen, Kazuhiro Nogita, Stuart McDonald, David StJohn, Hideyuki Yasuda |
| On-Site Speaker (Planned) |
Syeda Mehreen |
| Abstract Scope |
Developing Sn-Cu alloys as potential candidates for Pb-free high-temperature solders requires increased Cu content. Beyond 7.6 wt.% Cu, Sn-Cu alloys undergo peritectic solidification whereby needle-shaped primary Cu3Sn phase is formed, surrounded by secondary Cu6Sn5. Suppressing Cu3Sn in the bulk solder is considered to be a potential strategy to achieve mechanically favourable high-temperature Pb-free solders. Alloying additions and cooling rate can have a significant effect on the nucleation and growth of Cu3Sn in these peritectic Sn-Cu alloys. Ternary Ni additions alloyed to Sn-10Cu have resulted in complete Cu3Sn suppression. This work further investigates the effect of (i) alloying with Ni additions and (ii) cooling rate on the suppression of the Cu3Sn phase in Sn-10Cu alloys via directional solidification and real-time in situ synchrotron X-Ray imaging. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |