| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances and Discoveries in Non-Equilibrium Driven Nanomaterials and Thin Films
|
| Presentation Title |
Controlled Kirkendall Voiding in Al-Au and Cu-Au Thin Films by Adjusting Sputtering Parameters |
| Author(s) |
Oliver Wipf, Ralph Spolenak |
| On-Site Speaker (Planned) |
Oliver Wipf |
| Abstract Scope |
Originally seen as a problem for many applications Kirkendall voiding has now become a potential process to facilitate the manufacturing of hollow and porous nanostructures by non-equilibrium diffusion of vacancies. It has been shown that it is possible to create hollow particles, fibers and porous thin films. However, controlling the voids' size and position, especially in thin film diffusion systems, is not trivial. Here, we show a way to control the voiding behavior in Al-Au and Cu-Au thin film diffusion system, manufactured by physical vapor deposition (PVD). This is achieved by controlling the thickness of the thin film layers, changing their morphology by varying the sputtering parameters, and adjusting the annealing procedure. After the diffusion process, the resulting metal phases and the voids are characterized by FIB tomographies, TEM analyses and XRD, while the mechanical properties are investigated by nanoindentation. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Mechanical Properties, Other |