| About this Abstract |
| Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
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| Symposium
|
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Presentation Title |
Prediction of Inter-pass Temperature for Large-scale Double Sided Component Fabricated Electron Beam Wire Additive Manufacturing |
| Author(s) |
Guru Madireddy, Zachary Corey, Ron Aman, Matt Bement, Yousub Lee |
| On-Site Speaker (Planned) |
Yousub Lee |
| Abstract Scope |
Wire-based direct energy deposition (DED) technologies have been rapidly adopted for manufacturing of large structural components in aerospace and aircraft power generation industries. As the part size becomes larger, the deposition often requires expected/unexpected pauses (e.g., wire-spool change, flipping part for double-sided part) for the completion of part. The pauses lead to change of thermal profile and heat build-ups during printing and cooling that can result in inhomogeneity in distribution of defects or residual stresses. Therefore, understanding and predicting the effect of process parameters on dynamic variation of thermal profile during printing and cooling are crucial for tight control of qualifying the material/mechanical properties. In this research, we developed a part-scale thermal model for validation of inter-pass temperatures for the double-sided additive component, i.e., Droplink (> 700 mm in length). The prediction showed a good agreement in trend and values within 10% error to the pyrometer measured temperature. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |