| About this Abstract |
| Meeting |
TMS Specialty Congress 2024
|
| Symposium
|
Accelerating Discovery for Mechanical Behavior of Materials 2024
|
| Presentation Title |
A Strong Fracture-resistant High-entropy Alloy With Nano-bridged Honeycomb Microstructure: A Critical Role of 3D Printing in Promoting Strength Without Compromising Toughness |
| Author(s) |
Punit Kumar, Sheng Huang, David H. Cook, Kai Chen, Upadrasta Ramamurty, Xipeng Tan, Robert Ritchie |
| On-Site Speaker (Planned) |
Punit Kumar |
| Abstract Scope |
Strengthening materials via conventional “top-down” processes involves restricting dislocation movement by precipitation or grain-refinement, which invariably restricts the movement of dislocations away from, or towards, the crack tip, thereby severely compromising their fracture resistance. A high-entropy alloy Al0.5CrCoFeNi was produced by the laser powder bed fusion process, a “bottom-up” additive manufacturing process similar to how nature builds structures, with the microstructure resembling a nano-bridged honeycomb structure consisting of a fcc matrix and an interwoven hexagonal net of an ordered bcc B2 phase. While the B2 phase, combined with high-dislocation density and solid-solution strengthening, provides strength to the material, the nano-bridges of dislocations connecting the fcc cells, i.e., channels between the B2 phase on the cell boundaries, provide highways for dislocation movement away from the crack tip. Consequently, the nature-inspired microstructure imparts the material with an unprecedented combination of strength and toughness, details of which will be discussed during the presentation. |
| Proceedings Inclusion? |
Definite: Other |