| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Materials for Energy Conversion and Storage VI
|
| Presentation Title |
E-23: Nanotwinned Copper Films Retaining High Strength and Moderate Elongation after Low Temperature Annealing |
| Author(s) |
Hsiang-Yuan Cheng, Chih Chen |
| On-Site Speaker (Planned) |
Hsiang-Yuan Cheng |
| Abstract Scope |
Recently, highly (111) preferred nanotwinned copper (nt-Cu) has been studied for applications in 3D IC packaging and electrodes for batteries. The mechanical strength and hardness of nt-Cu is almost the same comparing to Cu alloys, but nt-Cu possesses a better electrical conductivity, which is almost the same as bulk Cu. For some applications, the Cu films may ranges from 5 µm to 50µm. However, the mechanical properties of the nt-Cu films as a function of plating thickness is not clear.
In this study, four different thickness of nt-Cu: 5µm, 10µm,30µm,and 50µm were electroplated, and some of them were annealed at 150oC. Then they are subjected to hardness and tensile tests. We used a tensile tester and a nanoindenter to investigate the elongation and hardness of each sample. We aim to fabricate Cu films with various thickness with desirable elongation and hardness after low temperature annealing at 150oC. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |