| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications XIII
|
| Presentation Title |
A Study of Interfacial Reaction of Ni(P)/SnS Couples |
| Author(s) |
Wei Ching Lai, Chien-Neng Liao |
| On-Site Speaker (Planned) |
Wei Ching Lai |
| Abstract Scope |
Tin monosulfide (SnS), a low-cost IV-VI thermoelectric material, has the advantages of low lattice thermal conductivity, low cost, and abundance on Earth. In addition to the thermoelectric figure of merit (zT), the electrical and thermal interface resistances of thermoelectrics in contact with metallic electrodes should be considered in the fabrication of thermoelectric modules. In this study, a Ni(P) layer was deposited on the SnS bulk as a diffusion barrier by electroless plating and utilized Sn-3Ag-0.5Cu as a bonding layer to contact the Cu substrate. The growth kinetics of the Ni(P) layer was investigated. A continuous intermetallic compound layer at the Ni(P)/SnS interfaces subjected to thermal aging was identified as Ni3(Sn,S)4 phase. The shear strength can reach 9.71 MPa on average and the fracture surface is in thermoelectric material, indicating that Sn-3Ag-0.5Cu is suitable for SnS bulk in low-temperature thermoelectric application. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Electronic Materials, Copper / Nickel / Cobalt |