| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Characterization Techniques for Quantifying and Modeling Deformation
|
| Presentation Title |
In Situ Thermomechanical Loading of Nanocrystalline Alloys |
| Author(s) |
Thomas R. Koenig, Hongyu Wang, Yong Zhu, Ankit Gupta, Alicia Koenig, Garritt J. Tucker, Gregory B. Thompson |
| On-Site Speaker (Planned) |
Gregory B. Thompson |
| Abstract Scope |
Nanocrystalline (NC) Ni-40Cu and Ni-40Cu-0.6P (at.%) alloys were mechanically loaded in tension at ambient (22 °C) and elevated (150 °C) temperatures with the deformed nanostructure captured by in situ transmission electron microscopy. The thermomechanical loading was provided by a custom microelectromechanical system (MEMS) shuttle structure. While mechanical strength softening was observed in both alloys upon thermomechanical heating, the fracture strength of the ternary alloy was higher than its binary counterpart regardless of temperature with intergranular failure observed as the failure mechanism. In the binary alloy, a coarse-toothed fracture profile was noted before failure compared to a fine-toothed fracture profile observed in the ternary alloy. Collectively, these differences were linked to P within the grain boundaries through atomistic simulations. Digital image correlation (DIC) was employed and is discussed for in situ image data mining, with the current limitations of the technique considered for both crystalline and non-crystalline materials. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Thin Films and Interfaces, |