About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
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AI/Data Informatics: Computational Model Development, Verification, Validation, and Uncertainty Quantification
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Presentation Title |
Microstructural Analysis of Stainless Steel Backscatter Electron Images by Combining EBSD Data and Deep Learning |
Author(s) |
Julia Nguyen, Mohammad Fuad Nur Taufique, Jenna Pope, Julian Escobar |
On-Site Speaker (Planned) |
Julia Nguyen |
Abstract Scope |
The characterization of microstructural features is essential to understanding and predicting material performance. One powerful tool for microstructural characterization is electron backscatter diffraction (EBSD), which provides quantitative information on features such as shape, size, and orientation of grains. However, scanning over large areas (e.g., on the millimeter scale) can be time-consuming with EBSD, as compared to collecting backscatter electron (BSE) images in the scanning electron microscope (SEM). Here, we describe the neural network-based semantic segmentation of BSE images for an “EBSD-like” microstructural analysis of grains and grain boundaries. We find that “out-of-the-box” segmentation algorithms produce unconnected grain boundaries, leading to errors in grain size calculations. To overcome this, we implement a topological loss function during training that encourages the network to produce connected grain boundaries. We demonstrate the utility and accuracy of our models by performing grain size and shape analysis of friction stir processed (FSP) austenitic stainless steel. |
Proceedings Inclusion? |
Planned: |
Keywords |
Characterization, Machine Learning, |