| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
The Growth and Coarsening Kinetics of Ag3Sn in SAC305 Solders |
| Author(s) |
Jingwei Xian, Sergey A Belyakov, Christopher Gourlay |
| On-Site Speaker (Planned) |
Jingwei Xian |
| Abstract Scope |
Primary and eutectic Ag3Sn are important in the performance of SAC305 solders. By coupling real-time synchrotron radiography with EBSD, it is shown that primary Ag3Sn can grow in simple or dendritic plates depending on Ag contents. Higher Ag levels tend to form more dendritic Ag3Sn plates with measured crystallography. Here we also present the coarsening kinetics of eutectic Ag3Sn at various temperatures. The result is discussed with the influence of beta-Sn nucleation undercooling and can be used to predict the eutectic size after thermal cycling. It is further shown that bigger eutectic Ag3Sn size will deteriorate the shear performance of the solder joints. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |