| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Developing High-Reliability Solder Alloys for Automotive Electronics |
| Author(s) |
Wei-Ting Lin, Kelvin Li, Watson Tseng, Chang-Meng Wang, Albert T. Wu |
| On-Site Speaker (Planned) |
Wei-Ting Lin |
| Abstract Scope |
Developing high-reliability solder materials is crucial to meet the stringent requirements of modern automotive electronics. This study evaluates the performance of new lead-free solder alloys, specifically the novel PF918 (Sn4Ag3Bi-X) alloy, designed to enhance device assembly reliability. The reliability of PF918 is compared to traditional Sn3Ag0.5Cu (SAC) solder paste, with both being assembled on CTBGA228 components. The components were subjected to thermal aging at 125°C, drop tests (JESD22-B111A), and thermal cycle tests (IPC-9701B). Advanced analytical techniques, including Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Spectroscopy (EDS), were utilized to examine the microstructure and intermetallic compound (IMC) growth at fracture sites. Electron Backscatter Diffraction (EBSD) was employed to investigate the relationship between stress relaxation, crack propagation, and solder microstructure after thermal cycling. The results demonstrate that PF918 offers promising reliability improvements, making it a suitable candidate for high-performance automotive electronic applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |