| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
Investigation of Metal Filament Formation |
| Author(s) |
Chung-Yu Chiu, Cheng-Yi Liu |
| On-Site Speaker (Planned) |
Chung-Yu Chiu |
| Abstract Scope |
Lead frame is an important medium for connecting chip and printed circuit board. However, during lead frame manufacturing, filaments might be formed at the edge of burr side after stamping process. The residual filaments on the lead frame would bring about electrical short and further cause device disable. The reason of filament formation is partial loosen of burr which have intensive relation with bur height. The height of burr would be influenced by several factors such as hardness, grain size, punch shape, stamping force and so on. We thought that properties of bulk copper might have the most influential to burr height. In this study, electroplated nickel layer were used to simulate the lead frame manufacture process. By changing bulk copper properties to analyze how these properties affect burr height then, further cause filament issue during stamping process. The mechanism of filament formation will be discussed in this study. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |