| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Microstructural Fingerprints for Secure Microelectronic Packaging |
| Author(s) |
Min Cho, Eshan Ganju, Nikhilesh Chawla |
| On-Site Speaker (Planned) |
Min Cho |
| Abstract Scope |
Security for electronic packages has been a key focus in recent years due counterfeiting. Counterfeiters tamper or clone existing microelectronics to steal intellectual property resulting in huge costs to the semiconductor industry. In this talk we will describe the concept of hierarchical microstructural fingerprints for security. This microstructural fingerprint is obtained by mixing tantalum particles in a photopolymer. This mixture is cured and characterized by x-ray microtomography. The microstructure, then, consists of a unique signature of the tantalum particle distributions. The heterogeneity in particle distribution was studied by x-ray radiographs and subsequent image analysis. Differential scanning calorimetry was used to quantify the degree of curing. The influence of particle distribution and x-ray curing over time was studied and will be discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Polymers, Characterization |