| Abstract Scope |
Hybrid additive manufacturing (AM) is transforming the world of manufacturing by enabling the creation of complex, multifunctional devices. Traditional approaches in printed electronics often rely on single-method fabrication techniques, limiting the scope and functionality of the devices produced. In contrast, hybrid AM combines multiple additive processes, resulting in access to unique manufacturing solutions and a large material library. This talk will explore how our lab has used hybrid AM to address critical challenges in printed electronics, such as creating advanced surface coatings, developing self-sensing structures, enhancing energy storage solutions, and incorporating active materials for smart electronics. By leveraging the capabilities of hybrid AM, we can produce devices with enhanced functionality, reliability, and performance, paving the way for innovative applications for next-generation printed electronics. |