About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Investigation of Interdiffusion In Micro Solder Joint with a Fine Pitch Copper Pillar Subjected to Electromigration Stressing |
Author(s) |
Hossein Madanipour, Yi Ram Kim, Allison Theresa Osmanson, Mohsen Tajedini, Choong-Un Kim |
On-Site Speaker (Planned) |
Hossein Madanipour |
Abstract Scope |
This study concerns the effect of electromigration (EM) on the micro solder joint when testing is conducted under excessively high current densities. The solder joint used in our study was a lead-free Sn-Ag-Cu alloy placed between a fine pitch Cu pillar and a lead frame. Samples tested in a customized oil bath to minimize the potential artifacts of Joule heating. The results showed that EM makes the conversion of the solder joint to Cu6Sn5 and then Cu3Sn IMC phase to proceed faster because of enhanced atomic flux of Cu. Further, it is found that the interdiffusion between Cu and Sn continues even after full conversion of the solder to IMC because of EM forces Cu to migrate to IMC, which in turn results in counter flux of Sn directed toward Cu. This process is found to occur along the grain boundaries, clear evidence of which is obtained in our study. |
Proceedings Inclusion? |
Planned: |