| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Low-temperature Direct Bonding of Co-sputtered Nano-twinned Cu-Ag Alloy Thin Films |
| Author(s) |
Fan-Yi Ouyang, Chun-Yen Li, Yu Tang |
| On-Site Speaker (Planned) |
Yu Tang |
| Abstract Scope |
In 3D-IC advanced packaging technology, metal-to-metal direct bonding has become a key to heterogeneous integration. In this study, we introduced 2.3 at% to 6.6 at% copper into silver thin film by co-sputtering technique and we successfully produced nano-twinned Cu-Ag alloy thin films with high (111) texture. After introducing Cu into Ag, the hardness of the nano-twinned silver thin film increased from 1.75GPa to 2.87 GPa, further improving the mechanical strength of the silver thin film. The direct bonding of nano-twinned Cu-Ag alloy thin films was conducted at 190-200 °C in atmospheric and vacuum environments, respectively, to understand the microstructural evolution and bonding quality. The results show that samples can be bonded at 200 °C in a low vacuum environment with good mechanical and electrical performance. The bonding mechanism of nano-twinned alloy films will be discussed in detail in this study. |
| Proceedings Inclusion? |
Planned: |