| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Microstructural Evolution and Material Properties Due to Manufacturing Processes: A Symposium in Honor of Anthony Rollett
|
| Presentation Title |
Advantages and Limitations of the Coupled Random Cellular Automata Finite Element Model of Dynamic Recrystallization |
| Author(s) |
Lukasz Madej, Kacper Pawlikowski, Mateusz Sitko, Konrad Perzynski |
| On-Site Speaker (Planned) |
Lukasz Madej |
| Abstract Scope |
Dynamic and static recrystallization are examples of fundamental phenomena in materials science, significantly impacting the microstructure and mechanical properties of components subjected to large plastic deformations. Experimental research on that topic carried out for a wide range of new metallic materials is often supported by computational materials science. Direct consideration and detailed understanding of these phenomena are possible with a class of full-field numerical models based on, i.e., the cellular automata (CA) method, which has been developed intensively for many years. However, despite many advantages, the CA method has some limitations related to computational domain geometry changes at high-temperature forming conditions, which are typical, e.g., for dynamic recrystallization. The use of random cellular automata (RCA) allows to overcome these limitations. However, the RCA must be fully coupled with the finite element mesh, which eventually leads to increased computational times. The details of the recently developed coupled RCAFE (random cellular automata finite element) model for dynamic recrystallization simulations will be presented, including main assumptions and coupling strategies. The advantages and limitations of this approach will be particularly discussed.
Professor Rollett's research has continuously inspired the author's interest in advanced microstructure evolution modelling techniques for almost two decades. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Computational Materials Science & Engineering, ICME, Modeling and Simulation |