| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environments |
| Author(s) |
Ande Kitamura, Ruben Contreras, Tae-Kyu Lee |
| On-Site Speaker (Planned) |
Tae-Kyu Lee |
| Abstract Scope |
Recent application in quantum computing and extreme environment end-use conditions pushed the temperature limit for an electric component to an unprecedented low temperature. Although the performance of those components are those temperature range are extensively studied, the interconnections which are still mainly Sn based and needs a thorough observation and assessment to support the mechanical and electrical stability at those low environments. Sn based solder interconnects are subjected to be shear tested at various temperatures between 150°C and -196°C. The isothermal aging impact and the testing temperature reveals a variation of mechanical response, which will be discussed. The shear region between the intermetallic phase and solder interface show a dynamic chemical gradient with different aging conditions and surface finish combination, which reveal a specific degradation mechanism. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |